Socket connector for an electronic package

ABSTRACT

A socket connector includes a socket substrate having first socket substrate conductors and second socket substrate conductors, receptacle contacts electrically coupled to corresponding first socket substrate conductors and socket contacts electrically coupled to corresponding second socket substrate conductors. The receptacle contacts have receptacles receiving pin contacts of an electronic package and the socket contacts have terminating ends and mating ends with deflectable spring beams terminated to package contacts of the electronic package. At least one of the first socket substrate conductors and the second socket substrate conductors are configured to electrically connect the electronic package with the host circuit board.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims benefit to U.S. Provisional Application No.62/585,268, filed Nov. 13, 2017, titled “CABLE SOCKET CONNECTOR ASSEMBLYFOR AN ELECTRONIC PACKAGE” and claims benefit to U.S. ProvisionalApplication No. 62/632,383, filed Feb. 19, 2018, titled “SOCKETCONNECTOR FOR AN ELECTRONIC PACKAGE”, the subject matter of each areherein incorporated by reference in their entirety.

BACKGROUND OF THE INVENTION

The subject matter herein relates generally to a socket connector for anelectronic package of an electronic system.

The ongoing trend toward smaller, lighter, and higher performanceelectrical components and higher density electrical circuits has led tothe development of surface mount technology in the design of printedcircuit boards and electronic packages. Surface mountable packagingallows for a separable connection of an electronic package, such as anintegrated circuit or a computer processor, to pads on the surface ofthe circuit board rather than by contacts or pins soldered in platedholes going through the circuit board. Surface mount technology mayallow for an increased component density on a circuit board, therebysaving space on the circuit board.

One form of surface mount technology includes socket connectors. Asocket connector may include a substrate with terminals on one side ofthe substrate and an array of conductive solder elements, such as a ballgrid array (BGA), on the opposite side, electrically connected throughthe substrate by conductive pathways through the substrate. Theterminals engage contacts on the electronic package and the solderelements are affixed to conductive pads on a host circuit board, such asa mother board, to electrically join the electronic package with thehost circuit board. The terminals have a compressible interface.Conventional socket connectors provide a separate structure to hold theelectronic package in place on the substrate and compress the terminals.Such structure adds cost to the socket connector and are bulky andoccupy significant space on the host circuit board.

Additionally, conventional architecture provides the socket connectorbetween the electronic package and the host circuit board. Electricalpaths are defined through the socket connector to the host circuit boardto drive signals from the bottom of the electronic package, through thesocket connector into the host circuit board. Such electrical paths arethen routed to an electrical connector mounted at a separate location onthe host circuit board, such as a high speed electrical connector. Therouting of the circuits between the socket connector and the high speedelectrical connector on the host circuit board occupies board space onthe host circuit board. Additionally, the electrical performance of theelectronic system is reduced by the multiple electrical interfacesbetween the electronic package and the high speed connector on the hostcircuit board. Conventional systems are struggling to meet signal andpower output from the electronic package because there is a need forsmaller size and higher number of conductors while maintaining goodelectrical performance through the system.

A need remains for a high speed socket connector having improvedelectrical performance.

BRIEF DESCRIPTION OF THE INVENTION

In one embodiment, a socket connector is provided for an electronicsystem including a socket substrate having an upper surface and a lowersurface mounted to a host circuit board. The socket substrate has amating area for mating with an electronic package that includes firstsocket substrate conductors and second socket substrate conductors. Thesocket connector includes receptacle contacts electrically coupled tocorresponding first socket substrate conductors to define a receptaclearray interface with the electronic package. The receptacle contactshave receptacles configured to receive pin contacts defining firstpackage contacts of the electronic package to electrically connect theelectronic package to the first socket substrate conductors. The socketconnector includes socket contacts electrically coupled to correspondingsecond socket substrate conductors to define a land grid array interfacewith the electronic package. The socket contacts have terminating endsand mating ends. The terminating ends are terminated to correspondingsecond socket substrate conductors. The mating ends have deflectablespring beams configured to be terminated to corresponding second packagecontacts of the electronic package to electrically connect theelectronic package to the second socket substrate conductors. At leastone of the first socket substrate conductors and the second socketsubstrate conductors are configured to electrically connect theelectronic package with the host circuit board.

In another embodiment, a socket connector is provided for an electronicsystem including a socket substrate having an upper surface and a lowersurface mounted to a host circuit board. The socket substrate has afirst mating area for mating with an electronic package and a secondmating area remote from the first mating area. The socket substrateincludes first socket substrate conductors and second socket substrateconductors. The first socket substrate conductors extend between thelower surface and the upper surface at first mating area. The secondsocket substrate conductors extend between the first mating area and thesecond mating area. The socket connector includes an electricalcomponent terminated to the socket substrate at the second mating areabeing electrically connected to the second socket substrate conductors.The socket connector includes receptacle contacts electrically coupledto corresponding first socket substrate conductors to define areceptacle array interface with the electronic package. The receptaclecontacts have receptacles configured to receive pin contacts definingfirst package contacts of the electronic package to electrically connectthe electronic package to the first socket substrate conductors. Thefirst socket substrate conductors and the receptacle contacts areconfigured to electrically connect the electronic package with the hostcircuit board. The socket connector includes socket contactselectrically coupled to corresponding second socket substrate conductorsto define a land grid array interface with the electronic package. Thesocket contacts have terminating ends and mating ends. The terminatingends are terminated to corresponding second socket substrate conductors.The mating ends have deflectable spring beams configured to beterminated to corresponding second package contacts of the electronicpackage to electrically connect the electronic package to the secondsocket substrate conductors. The second socket substrate conductors andthe socket contacts are configured to electrically connect theelectronic package with the electrical component.

In a further embodiment, an electronic system is provided including ahost circuit board having host contacts, an electronic package havingfirst package contacts and second package contacts, and a socketconnector for electrically connecting the electronic package with thehost circuit board. The socket connector includes a socket assembly andan electrical component. The socket assembly has a socket frame, asocket substrate coupled to the socket frame, receptacle contactscoupled to the socket substrate and socket contacts coupled to thesocket substrate. The socket frame has a socket opening receiving theelectronic package. The socket substrate has first socket substrateconductors and second socket substrate conductors. The receptaclecontacts are electrically coupled to corresponding first socketsubstrate conductors. The receptacle contacts have receptacles receivingcorresponding first package contacts. The socket contacts haveterminating ends and mating ends. The terminating ends are terminated tocorresponding second socket substrate conductors and the mating endshaving deflectable spring beams terminated to corresponding secondpackage contacts. The first socket substrate conductors and thereceptacle contacts electrically connect the electronic package to thehost circuit board and the second socket substrate conductors and thesocket contacts electrically connect the electronic package to theelectrical component.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded view of an electronic system having a socketassembly formed in accordance with an exemplary embodiment.

FIG. 2 is a perspective view of a socket contact for the socket assemblyin accordance with an exemplary embodiment.

FIG. 3 is a perspective view of a socket contact for the socket assemblyin accordance with an exemplary embodiment.

FIG. 4 is a perspective view of a socket contact for the socket assemblyin accordance with an exemplary embodiment.

FIG. 5 is a perspective view of a receptacle contact in accordance withan exemplary embodiment.

FIG. 6 is a perspective view of a portion of the socket assembly showingreceptacle contacts in accordance with an exemplary embodiment.

FIG. 7 is a schematic view of the electronic system in accordance withan exemplary embodiment.

FIG. 8 is a schematic view of the electronic system in accordance withan exemplary embodiment.

FIG. 9 is a schematic view of the electronic system in accordance withan exemplary embodiment.

FIG. 10 is a schematic view of the electronic system in accordance withan exemplary embodiment.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 is an exploded view of an electronic system 100 formed inaccordance with an exemplary embodiment. The electronic system 100includes a socket connector 102 that receives an electronic package 104,such as an integrated circuit. The socket connector 102 includes asocket assembly 106 and one or more electrical components 108. Thesocket assembly 106 is configured to be directly electrically connectedto the electronic package 104. The electrical component 108 isconfigured to be directly electrically connected to the socket assembly106. The socket assembly 106 electrically connects the electronicpackage 104 with the electrical component 108. In an exemplaryembodiment, the socket assembly 106 is coupled to a host circuit board110, such as a motherboard. The socket assembly 106 electricallyconnects the electronic package 104 with the host circuit board 110.

In the illustrated embodiment, the electronic package 104 is coupled tothe top of the socket assembly 106 at a first upper mating area 112,multiple electrical components 108 are coupled to the top of the socketassembly 106 at second and third upper mating areas 114, 115,respectively, and the bottom of the socket assembly 106 is coupled tothe host circuit board 110 at a lower mating area 116. Otherarrangements are possible in alternative embodiments. For example,greater or fewer electrical components 108 may be coupled to the socketassembly 106. Other components may be coupled to the host circuit board110. The electronic system 100 allows connection of the electricalcomponent(s) 108 to the electronic package 104 directly through thesocket assembly 106 as opposed to being electrically connected throughthe host circuit board 110. For example, high speed data signals may berouted through the socket assembly 106 between the electricalcomponent(s) 108 and the electronic package 104 rather than having thehigh speed data signals routed through the socket assembly 106 to thehost circuit board 110 and then through the host circuit board 110 tothe electrical component(s) 108.

The electrical component 108 may be any type of component, such as adata communication device. For example, the electrical component 108 maybe an integrated circuit, such as an application-specific integratedcircuit (ASIC), a chip, a microprocessor, and the like. In other variousembodiments, the electrical component 108 may be an electricalconnector, such as a high speed differential pair receptacle connector,a header connector, a card edge connector, and the like. The electricalconnector may define an interface for interfacing with another matingconnector, such as a cable connector, a paddle card connector, oranother type of mating connector. The electrical connector may be afiberoptic connector or electro-optic component. In other variousembodiments, the electrical component 108 may be a cable assemblyconfigured to be electrically connected to the socket assembly 106. Forexample, the cable assembly may include contacts mated to the socketassembly 106 at a separable interface or the cable assembly may includecables soldered to the socket assembly 106. The cable assembly may be afiberoptic cable assembly. Having the electrical component 108 mounteddirectly to the socket assembly 106 reduces the number of electricalinterfaces along the signal paths between the electronic package 104 andthe electrical component 108 to enhance electrical performance of theelectronic system 100. For example, high speed data signals may betransferred directly from the electronic package 104 to the electricalcomponent 108 through the socket assembly 106 rather than being firstrouted through the host circuit board 110.

In an exemplary embodiment, electrical paths from the electronic package104 to the electrical component 108 pass through the socket assembly 106and are not routed through the host circuit board 110. For example, inthe illustrated embodiment, the electrical paths are high speedelectrical paths routed to the electrical component 108 through thesocket assembly 106 between the first and second upper mating areas 112,114. Other electrical paths, such as low speed electrical paths andpower electrical paths, are routed between the upper mating area 112 andthe lower mating area 116 to electrically connect the electronic package104 and the host circuit board 110. An interface is provided between thesocket assembly 106 and the host circuit board 110, such as a ball gridarray (BGA) having solder balls soldered between the host circuit board110 and corresponding socket substrate conductors on the bottom of thesocket assembly 106. However, other types of interfaces may be utilizedin alternative embodiments, such as a land grid array (LGA). Optionally,the electrical paths between the socket assembly 106 and the hostcircuit board 110 may include high speed electrical paths. Optionally,the socket assembly 106 may include a second lower mating area 118, suchas aligned with the second upper mating area 114, for interfacing withthe host circuit board 110, such as for electrically connecting theelectrical component 108 and the host circuit board 110.

In an exemplary embodiment, the socket assembly 106 includes a socketsubstrate 120 having socket substrate conductors 122 that defineelectrical paths between the electronic package 104 and the electricalcomponent 108 and between the electronic package 104 and the hostcircuit board 110. The socket substrate 120 may be a printed circuitboard and the socket substrate conductors 122 may be circuits, pads,traces (of and/or within the socket substrate 120), vias, and the likeof the printed circuit board. The socket assembly 106 includes socketcontacts 124 coupled to the socket substrate 120 and receptacle contacts134 coupled to the socket substrate 120. The socket contacts 124 areelectrically connected to corresponding socket substrate conductors 122.The socket contacts 124 are configured to be electrically connected tothe electronic package 104. The socket contacts 124 may be arranged inan array defining a land grid array (LGA) interface configured to mateto package contacts, such as contact pads of the electronic package 104.In various embodiments, at least some of the socket contacts 124 may beelectrically connected to the host circuit board 110 by correspondingsocket substrate conductors 122. The receptacle contacts 134 areelectrically connected to corresponding socket substrate conductors 122.The receptacle contacts 134 are configured to be electrically connectedto the host circuit board 110. The receptacle contacts 134 may bearranged in an array defining a receptacle array interface ofreceptacles configured to receive male contacts, such as pin contacts,extending from the electronic package 104. In various embodiments, atleast some of the receptacle contacts 134 may be electrically connectedto the electrical component 108 by corresponding socket substrateconductors 122.

The electrical component 108 may be terminated directly to thecorresponding socket substrate conductors 122, such as by soldering tothe socket substrate conductors 122. Alternatively, the socket substrateconductors 122 may be electrically connected to the electrical component108 using contacts, pins, solder balls, conductive elastomeric columns,or other intervening conductive elements. For example, in an exemplaryembodiment, the socket substrate 120 includes an interface on the topside for electrical connection directly to the electrical component 108,such as an LGA interface, a BGA interface, and the like. As such, thesocket assembly 106 electrically connects the electrical component 108to the top of the socket substrate 120. The electrical component 108 mayadditionally or alternatively be electrically coupled to the bottom ofthe socket substrate 120.

In an exemplary embodiment, the socket connector 102 includes a socketframe 126 that supports components of the socket connector 102. Forexample, the socket frame 126 may support the socket assembly 106. Thesocket frame 126 may support the electronic package 104. The socketframe 126 may support the electrical component 108. The socket frame 126may be used to align the electronic package 104 with the first uppermating area 112 for mating the electronic package 104 with the socketassembly 106. For example, frame walls 128 of the socket frame 126 maysurround a socket opening 170 that receives the electronic package 104and the frame walls 128 may orient and align the electronic package 104in one or more directions. In an exemplary embodiment, the socket frame126 may limit or stop compression of the compressible interface toprevent damage to various components. The socket frame 126 may holdvarious components together for mounting to other components. The socketframe 126 may receive the socket substrate 120 or alternatively, may bemounted to the top of the socket substrate 120. For example, theelectronic package 104 may be pre-assembled to the socket frame 126 andthe socket substrate 120 prior to mounting the socket assembly 106 tothe host circuit board 110.

In an exemplary embodiment, the electronic system 100 includes a heatsink 130 for dissipating heat from one or more of the components of theelectronic system 100, such as from the electronic package 104 and/orthe electrical component(s) 108 and/or the socket assembly 106 and/orthe host circuit board 110. Optionally, the heat sink 130 may be mountedto the host circuit board 110 and/or a mounting block 132 below the hostcircuit board 110. For example, the heat sink 130 may be secured to themounting block 132 using fasteners. Optionally, the components mayinclude one or more compressible interfaces therebetween. For example,the socket contacts 124 may define a separable, compressible interfacewith the electronic package 104. The socket contacts 124 may be springbiased against the electronic package 104 with the heat sink 130providing the hold down force for compressing the socket contacts 124.In alternative embodiments, other components may be used to provide thehold down force for compressing the socket contacts 124. For example,the mechanical connection of the pin contacts of the electronic package104 with the receptacle contacts 134 may provide sufficient hold downforce for compressing the socket contacts 124.

FIG. 2 is a perspective view of a socket contact 140 in accordance withan exemplary embodiment. The socket contact 140 may be used as one ormore of the socket contacts 124 (shown in FIG. 1) and is thus anexemplary embodiment of one of the socket contacts 124. As such thesocket contacts 124 may include any or all of the features of the socketcontact 140 described herein. The socket contact 140 extends between aterminating end 200 and a mating end 202. The socket contact 140 has abase 204 configured to be mounted to the socket substrate 120 (shown inFIG. 1). The mating end 202 extends from the base 204 and is configuredto be mated with the electronic package 104 (shown in FIG. 1). Theterminating end 200 extends from the base 204 and is configured to beterminated to the socket substrate 120.

In the illustrated embodiment, the terminating end 200 includes acompliant beam 206, such as an eye-of-the-needle contact, configured tobe press-fit into a plated via of the socket substrate 120. Thecompliant beam 206 may be soldered to the socket substrate 120 tomechanically and/or electrically connect the terminating end 200 to thesocket substrate 120. Other types of terminating ends 200 may beprovided in alternative embodiments. In an exemplary embodiment, theterminating end 200 includes one or more mounting tabs 208 extendingfrom the base 204 at the terminating end 200. For example, in theillustrated embodiment, the terminating end 200 includes two mountingtabs 208 at opposite sides of the socket contacts 140. The mounting tabs208 are configured to engage the socket substrate 120 to mount thesocket contact 140 on the socket substrate 120. The mounting tabs 208may be soldered to the socket substrate 120 to mechanically and/orelectrically connect the terminating end 200 to the socket substrate120.

The mating end 202 includes a spring beam 210 extending from the base204. The spring beam 210 is deflectable. In the illustrated embodiment,the spring beam 210 includes two beam arms 212 separated by a gap 214;however, the spring beam 210 may have other shapes in alternativeembodiments, including a single beam arm 212. Optionally, the springbeam 210 may be centered on the socket contact 140. In variousembodiments, the spring beam 210 may be aligned with the compliant beam206. In an exemplary embodiment, the socket contact 140 includes amating beam 216 at the distal end thereof defining a mating interface218 for mating with the electronic package 104. In an exemplaryembodiment, the mating interface 218 is a separable mating interface.The spring beam 210 may be resiliently deflected during loading tospring bias the mating beam 216 against the electronic package 104 toensure electrical connection between the socket contact 140 and theelectronic package 104. Optionally, the mating interface 218 may beapproximately aligned over the base 204 and/or the complaint beam 206such that the compressive forces are centered over and press in thedirection of the base 204 and/or the compliant beam 206, such as toreduce tilting or rotating the compliant beam 206 in the plated via. Themating end 202 may have other shapes and features in alternativeembodiments. For example, the mating end 202 may include a solder tailor solder tab at the mating end 202 configured to be soldered to theelectronic package 104.

FIG. 3 is a perspective view of a socket contact 142 in accordance withan exemplary embodiment. The socket contact 142 may be used as one ormore of the socket contacts 124 (shown in FIG. 1) and is thus anexemplary embodiment of one of the socket contacts 124. As such thesocket contacts 124 may include any or all of the features of the socketcontact 142 described herein. The socket contact 142 may be similar tothe socket contact 140 (shown in FIG. 2); however, the socket contact142 is a surface mount contact whereas the socket contact 140 is apress-fit socket contact. The socket contact 142 extends between aterminating end 220 and a mating end 222. The socket contact 142 has abase 224. The mating end 222 extends from the base 224 and is configuredto be terminated to the electronic package 104 (shown in FIG. 1). Theterminating end 220 extends from the base 224 and is configured to beterminated to the socket substrate 120 (shown in FIG. 1).

In an exemplary embodiment, the terminating end 220 includes one or moremounting tabs 228 extending from the base 224 at the terminating end220. For example, in the illustrated embodiment, the terminating end 220includes two mounting tabs 228 at opposite sides of the socket contacts142 and a central mounting tab 228 defining a solder tab configured tobe soldered to the socket substrate 120. The mounting tabs 228 areconfigured to engage the socket substrate 120 to mount the socketcontact 142 on the socket substrate 120. Optionally, all of the mountingtabs 228 may be soldered to the socket substrate 120 to mechanicallyand/or electrically connect the terminating end 220 to the socketsubstrate 120.

Optionally, the mating end 222 may be identical to the mating end 202(shown in FIG. 2) of the socket contact 140. The socket contact 142includes a spring beam 230 extending from the base 224 at the mating end222. The spring beam 230 is deflectable. In the illustrated embodiment,the spring beam 230 includes two beam arms 232 separated by a gap 234;however, the spring beam 230 may have other shapes in alternativeembodiments, including a single beam arm 232. In an exemplaryembodiment, the socket contact 142 includes a mating beam 236 at thedistal end thereof defining a mating interface 238 for mating with theelectronic package 104. In an exemplary embodiment, the mating interface238 is a separable mating interface. The spring beam 230 may beresiliently deflected during loading to spring bias the mating beam 236against the electronic package 104 to ensure electrical connectionbetween the socket contact 142 and the electronic package 104. Themating end 222 may have other shapes and features in alternativeembodiments. For example, the mating end 222 may include a solder tailor solder tab at the mating end 222 configured to be soldered to theelectronic package 104.

FIG. 4 is a perspective view of a socket contact 144 in accordance withan exemplary embodiment. The socket contact 144 may be used as one ormore of the socket contacts 124 (shown in FIG. 1) and is thus anexemplary embodiment of one of the socket contacts 124. As such thesocket contacts 124 may include any or all of the features of the socketcontact 140 described herein. In the illustrated embodiment, the socketcontact 144 is shown as a press-fit socket contact similar to the socketcontact 140 (shown in FIG. 2); however, the socket contact 144 may be asurface mount socket similar to the socket contact 142 (shown in FIG. 3)in alternative embodiments. The socket contact 144 extends between aterminating end 240 and a mating end 242. The socket contact 144 has abase 244. The mating end 242 extends from the base 224 and is configuredto be terminated to the electronic package 104 (shown in FIG. 1). Theterminating end 240 extends from the base 244 and is configured to beterminated to the socket substrate 120 (shown in FIG. 1).

The terminating end 240 includes a compliant beam 246, such as aneye-of-the-needle contact, configured to be press-fit into a plated viaof the socket substrate 120. The compliant beam 246 may be soldered tothe socket substrate 120 to mechanically and/or electrically connect theterminating end 240 to the socket substrate 120. Other types ofterminating ends 240 may be provided in alternative embodiments. In anexemplary embodiment, the terminating end 240 includes one or moremounting tabs 248 extending from the base 244 at the terminating end240. For example, in the illustrated embodiment, the terminating end 240includes a single mounting tab at a first side of the socket contacts144. The mounting tab 248 is configured to engage the socket substrate120 to mount the socket contact 144 on the socket substrate 120.Optionally, the mounting tab 248 may be soldered to the socket substrate120 to mechanically and/or electrically connect the terminating end 240to the socket substrate 120.

The socket contact 144 includes a spring beam 250 extending from thebase 244 at the mating end 242. In the illustrated embodiment, thespring beam 250 is offset relative to the compliant beam 246, such asshifted to a second side of the socket contact 144. The spring beam 250is deflectable. In the illustrated embodiment, the spring beam 250includes a single beam arm 252; however, the spring beam 250 may haveother shapes in alternative embodiments. In an exemplary embodiment, thesocket contact 144 includes a mating beam 256 at the distal end thereofdefining a mating interface 258 for mating with the electronic package104. In an exemplary embodiment, the mating interface 258 is a separablemating interface. The spring beam 250 may be resiliently deflectedduring loading to spring bias the mating beam 256 against the electronicpackage 104 to ensure electrical connection between the socket contact144 and the electronic package 104. The mating end 242 may have othershapes and features in alternative embodiments. For example, the matingend 242 may include a solder tail or solder tab at the mating end 242configured to be soldered to the electronic package 104.

FIG. 5 is a perspective view of a receptacle contact 146 in accordancewith an exemplary embodiment. The receptacle contact 146 may be used asone or more of the receptacle contacts 134 (shown in FIG. 1) and is thusan exemplary embodiment of one of the receptacle contacts 134. As suchthe receptacle contacts 134 may include any or all of the features ofthe receptacle contact 146 described herein. The receptacle contact 146extends between a terminating end 400 and a mating end 402. Thereceptacle contact 146 has a base 404 at the terminating end 400configured to be mounted to the socket substrate 120 (shown in FIG. 1).The base 404 is configured to be electrically connected to thecorresponding socket substrate conductor 122 (shown in FIG. 1), such asby a soldered connection, a press-fit connection, or another type ofelectrical connection.

The mating end 402 extends from the base 404 and is configured to bemated with a package contact of the electronic package 104 (shown inFIG. 1). In the illustrated embodiment, the package contact includes apin contact 412 having a mating end 414. The pin contact 412 isconfigured to be received in the receptacle contact 146. The mating end402 includes spring fingers 420 configured to engage the pin contact412. In an exemplary embodiment, the receptacle contact 146 includes astamped and formed body 422 with the base 404 and the spring fingers 420being stamped and formed from a common sheet of metal and formed into atube shape. The receptacle contact 146 defines a tube contact 424defining a receptacle 426 that receives the pin contact 412. The springfingers 420 extend into the receptacle 426 to engage the pin contact412. The spring fingers 420 are deflectable and configured to be springbiased against the pin contact 412. The spring fingers 420 may hold thepin contact 412 in the receptacle 426 and restrict backing out of thereceptacle 426. As such, the spring fingers 420 may impart a holdingforce on the pin contact 412 to hold the pin contact 412 in thereceptacle 426.

FIG. 6 is a perspective view of a portion of the socket assembly 106showing receptacle contacts 148 in accordance with an exemplaryembodiment. The receptacle contacts 148 may be used as one or more ofthe receptacle contacts 134 (shown in FIG. 1) and is thus an exemplaryembodiment of one of the receptacle contacts 134. As such the receptaclecontacts 134 may include any or all of the features of the receptaclecontact 148 described herein. Each receptacle contact 148 is a filmcontact 430 on the socket substrate 120. The film contact 430 is alayered structure on the socket substrate 120 at one or more layers ofthe socket substrate 120, such as at the top of the socket substrate120. The film contact 430 may be formed as one or more layers of aprinted circuit board, such as the printed circuit board of the socketsubstrate 120. Alternatively, the film contact 430 may be formedseparately from the printed circuit board of the socket substrate 120and applied to the printed circuit board.

The film contact 430 includes a backing layer 432 and a conductive layer434 on the backing layer 432. The conductive layer 434 is configured tobe electrically connected to the corresponding socket substrateconductor 122 (shown in FIG. 1), such as by a soldered connection. Thefilm contact 430 is configured to be mated with the correspondingpackage contact of the electronic package 104 (shown in FIG. 1), such aswith the corresponding pin contact 412. The film contact 430 includesopenings 436 defining film pads 438. The openings 436 extend through thebacking layer 432 and the conductive layer 434. Any number of openings436 may be provided to form any number of film pads 438. In theillustrated embodiment, the film contact 430 includes four film pads438. The film pads 438 are deflectable flaps. In the illustratedembodiment, the film pads 438 are triangular in shape. However, othershapes are possible in alternative embodiments. The film pads 438 havetips 440 defining mating interfaces configured to engage the pin contact412 when loaded into the film contact 430. The film contact 430 includesa receptacle 442 that receives the pin contact 412. The receptacle 442may be defined, at least in part, by the socket substrate 120. The filmpads 438 extend into the receptacle 442 to engage the pin contact 412.The film pads 438 may be spring biased against the pin contact 412 tohold the pin contact 412 in the receptacle 442. The tips 440 may diginto the pin contact 412 to help retain the pin contact 412 in thereceptacle 442. The film pads 438 may impart a holding force on the pincontact 412 to hold the pin contact 412 in the receptacle 442.

FIG. 7 is a schematic view of the electronic system 100 in accordancewith an exemplary embodiment. FIG. 7 illustrates the socket connector102 mounted to the host circuit board 110 and the electronic package 104coupled to the socket connector 102. For example, the electronic package104 is received in the socket frame 126 and mated to the socket contacts124 on the socket substrate 120. The electronic package 104 iselectrically connected to the host circuit board 110 by the receptaclecontacts 134 and the corresponding socket substrate conductors 122. Theelectrical component 108 is coupled to the socket substrate 120 andelectrically connected to the electronic package 104 by the socketcontacts 124 and the corresponding socket substrate conductors 122. Inthe illustrated embodiment, the receptacle contacts 134 are representedby the second receptacle contacts 148 having the film contacts 430.However, other types of receptacle contacts may be used in alternativeembodiments, such as the tube contacts 424 (shown in FIG. 5). The filmcontacts 430 are provided over the receptacles 442 to receive the pincontacts 412. In the illustrated embodiment, the receptacles 442 extendentirely through the socket substrate 120 between the top and thebottom; however, the receptacles 442 may only extend partially throughthe socket substrate, such as deep enough to accommodate the pincontacts 412 in alternative embodiments. In an exemplary embodiment, thefilm contacts 430 are electrically connected to socket substrateconductors 122 that are electrically connected to the host circuit board110. In the illustrated embodiment, the socket contacts 124 arerepresented by the second socket contacts 142. However, other types ofsocket contacts may be used in alternative embodiments. In an exemplaryembodiment, the socket contacts 142 are electrically connected to socketsubstrate conductors 122 that are electrically connected to theelectrical component 108.

In an exemplary embodiment, the electronic package 104 is an integratedcircuit component, such as an application-specific integrated circuit(ASIC). However, other types of electronic packages may be used inalternative embodiments, such as photonic integrated circuits, chips,processors, memory devices and the like. The electronic package 104includes a substrate 150 having an upper surface 152 and a lower surface154. The electronic package 104 includes package contacts 156. In anexemplary embodiment, the package contacts 156 are provided on the lowersurface 154. However the electronic package 104 may additionally oralternatively include the package contacts 156 on the upper surface 152.The package contacts 156 may include pads, pins, traces, vias, beams,wires or other types of contacts. In the illustrated embodiment, thepackage contacts 156 include at least two different types of packagecontacts 156, such as first package contacts 156 a and second packagecontacts 156 b. The first package contacts 156 a are represented by thepin contacts 412. The second package contacts 156 b are represented bypad contacts 157. In the illustrated embodiment, the electronic package104 includes an electronic component 158, such as a chip, on the uppersurface 152. The electronic component 158 may be electrically connectedto the package contacts 156 through traces or circuits of the substrate150. In an alternative embodiment, rather than having a separatesubstrate 150 and electronic component 158, the electronic package 104may include the electronic component 158 without the substrate 150having the package contacts 156 on the electronic component 158.

During assembly, the socket connector 102 is positioned above the hostcircuit board 110 and mechanically and electrically connected to anupper surface 160 of the host circuit board 110. For example, a BGA ofsolder balls 162 is used to electrically connect the socket connector102 to the host circuit board 110. During assembly, the electricalcomponent 108 is positioned above the socket substrate 120 andmechanically and electrically connected to the socket substrate 120 atthe second upper mating area 114. For example, the electrical component108 may be soldered to the socket substrate 120, such as using solderballs 164. During assembly, the electronic package 104 is positionedabove the socket assembly 106 and mechanically and electricallyconnected to the socket assembly 106. For example, the electronicpackage 104 may be aligned with a socket opening 170 in the socket frame126 and coupled to the socket contacts 124 and the receptacle contacts134. The socket contacts 124 are mated to the pad contacts 157 and thepin contacts 412 are received in the receptacle contacts 134. The socketframe 126 may align and position the electronic package 104 relative tothe socket assembly 106. The electronic package 104 is forced downwardonto the socket contacts 124 to compress the socket contacts 124.Optionally, the mechanical connection of the pin contacts 412 with thereceptacle contacts 134 is sufficient to overcome the spring forces ofthe socket contacts 124 and hold the electronic package 104 down on thesocket contacts 124. For example, the receptacle contacts 134 areconfigured to retain the pin contacts 412 in the receptacles 442 toprovide a hold down force on the electronic package 104. The hold downforce is greater than a spring force of the spring beams 230 of thesocket contacts 142 to compress the spring beams 210. Additionally oralternatively, the heat sink (shown in FIG. 1) may press downward on theelectronic package 104 to hold the electronic package 104 downward onthe socket contacts 124. In other various embodiments, the socket frame126 may be used to press downward on the electronic package 104, such aswith a clip or cover. In an exemplary embodiment, the socket frame 126may limit compression or downward movement of the electronic package104, such as to prevent damage or overstress of the socket contacts 124.

The socket substrate 120 may be a printed circuit board and the socketsubstrate conductors 122 may be circuits of the printed circuit board.For example, the socket substrate conductors 122 may include pads,traces, vias, and the like extending through and/or along one or morelayers of and/or within the socket substrate 120, according to variousembodiments. The socket substrate 120 includes an upper surface 260 anda lower surface 262. In an exemplary embodiment, portions of varioussocket substrate conductors 122 may be exposed on the upper surface 260and portions of various socket substrate conductors 122 may be exposedon the lower surface 262.

In an exemplary embodiment, the socket substrate conductors 122 includeupper contact pads 270 on the upper surface 260 at the first uppermating area 112 within the socket opening 170 for electrical connectionwith corresponding socket contacts 124 or receptacle contacts 134. Theupper surface 260 may have a solder mask or other layers at the uppersurface 260. The film contacts 430 may be provided at the upper surface260. Optionally, the upper contact pads 270 may be exposed at the uppersurface 260 for electrical connection with the socket contacts 124and/or the receptacle contacts 134. In an exemplary embodiment, thesocket substrate conductors 122 include conductive vias 272 extending atleast partially through the socket substrate 120. The conductive vias272 may be conductive vias or filled vias filled with conductivecolumns. Optionally, at least some of the conductive vias 272 extendentirely between the upper surface 260 and the lower surface 262. Theconductive vias 272 may receive corresponding compliant beams 206 forelectrical connection with corresponding socket contacts 142. Theconductive vias 272 may be associated with corresponding contact pads270. Alternatively, the conductive vias 272 may be provided without thecontact pads 270, for example, when directly connected to the conductivelayer 434 of the film contact 430. In an exemplary embodiment, thesocket substrate conductors 122 include lower contact pads 274 on thelower surface 262 at the first lower mating area 116 for electricalconnection with corresponding solder balls 162. The lower contact pads274 are electrically connected to corresponding conductive vias 272.

In an exemplary embodiment, the socket substrate conductors 122 includeupper contact pads 280 on the upper surface 260 at the second uppermating area 114 for electrical connection with the electrical component108, such as through the solder balls 164. The second upper mating area114 is outside of the socket opening 170 and remote from the first uppermating area 112. In an exemplary embodiment, the socket substrateconductors 122 include conductive vias 282 extending at least partiallythrough the socket substrate 120 between the upper surface 260 and thelower surface 262 at the second upper mating area 114 and the secondlower mating area 118. The conductive vias 282 are electricallyconnected to the electrical component 108 through corresponding uppercontact pads 280. In an exemplary embodiment, the socket substrateconductors 122 include lower contact pads 284 on the lower surface 262at the second lower mating area 118 for electrical connection withcorresponding solder balls 162. The lower contact pads 284 areelectrically connected to corresponding conductive vias 282.

In an exemplary embodiment, the socket substrate conductors 122 includetraces 290 on one or more layers of and/or within the socket substrate120 according to various embodiments. In order to maximize electricalperformance properties for high speed signal transmission, traces 290may be provided within the socket substrate 120 at a certain depth orvarying depths, according to various specific embodiments. The traces290 extend between the first upper mating area 112 and the second uppermating area 114. The traces 290 are electrically connected tocorresponding upper contact pads 270 and upper contact pads 280. Thetraces 290 electrically connect the electronic package 104 and theelectrical component 108.

In an exemplary embodiment, first electrical paths 292 are definedbetween the electronic package 104 and the host circuit board 110 by thereceptacle contacts 134, the upper contact pads 270, the conductive vias272, the lower contact pads 274 and the solder balls 162. The conductivelayer 434 of each receptacle contact 134 is electrically connected tothe upper contact pad 270 and the conductive via 272. The conductivelayer 434 is electrically connected to the pin contact 412. For example,the film pads 438 extend into the receptacle 442 to engage the pincontact 412. The film pads 438 engage the pin contacts 412 interior ofthe socket substrate 120, such as below the upper surface 260. Thebacking layer 432 provides support for the conductive layer 434. In anexemplary embodiment, the first electrical paths 292 are used for powerand low speed data signal paths; however, the first electrical paths 292may additionally or alternatively be used for high speed data signals.

In an exemplary embodiment, second electrical paths 294 are definedbetween the electronic package 104 and the electrical component 108 bythe socket contacts 142, the upper contact pads 270, the traces 290, theupper contact pads 280 and the solder balls 164. The socket contacts 142engage the pad contacts 157 of the electronic package 104 exterior ofthe socket substrate 120, such as above the upper surface 260. Thesecond electrical paths 294 may be used for high speed data signals.However, the second electrical paths 294 may additionally oralternatively be used for other purposes such as low speed data signals,power paths, and the like.

In an exemplary embodiment, third electrical paths 296 are definedbetween the electrical component 108 and the host circuit board 110 bythe solder balls 164, the upper contact pads 280, the conductive vias282, the lower contact pads 284 and the solder balls 162. The thirdelectrical paths 296 may be used for power and low speed data signalpaths. However, the third electrical paths 296 may additionally oralternatively be used for high speed data signals.

In an exemplary embodiment, the electrical component 108 is anintegrated circuit 310, such as an application-specific integratedcircuit (ASIC); however, other types of electrical component may be usedin alternative embodiments, such as photonic integrated circuits, chips,processors, memory devices and the like. The electrical component 108includes a substrate 300 having an upper surface 302 and a lower surface304. The electrical component 108 includes package contacts 306. In anexemplary embodiment, the package contacts 306 are provided on the lowersurface 304; however the electronic package 104 may additionally oralternatively include the package contacts 306 on the upper surface 302.The package contacts 306 may include pads, traces, vias, beams, wires orother types of contacts. The package contacts 306 are electricallyconnected to the socket substrate 120 at corresponding socket substrateconductors 122. For example, in the illustrated embodiment, the packagecontacts 306 are soldered to the upper contact pads 280; however, thepackage contacts 306 may be terminated by other means in alternativeembodiments, such as using a LGA, a BGA, press-fit beams, and the like.

FIG. 8 is a schematic view of the electronic system 100 in accordancewith an exemplary embodiment. FIG. 8 illustrates the socket connector102 mounted to the host circuit board 110 and the electronic package 104coupled to the socket connector 102 similar to the embodimentillustrated in FIG. 7. FIG. 8 illustrates the electrical component 108as an electrical connector 320, such as a card edge connector. Theelectrical connector 320 is coupled to the socket substrate 120 andelectrically connected to the electronic package 104 by correspondingsocket substrate conductors 122. In the illustrated embodiment, thereceptacle contacts 134 are represented by the first receptacle contacts146 having the tube contacts 424.

The electrical connector 320 includes a housing 322 having a mating end324 and a mounting end 326. The housing 322 holds contacts 328terminated to the socket substrate 120. In the illustrated embodiment,the housing 322 is a right angle housing having the mating end 324perpendicular to the mounting end 326. For example, the mating end 324may be at a front of the housing 322 and the mounting end 326 may be ata bottom of the housing 322. However, other types of housings 322 may beprovided in alternative embodiments, such as a vertical housing havingthe mating end 324 at the top of the housing 322. The contacts 328 maybe held in the housing 322. Alternatively, the contacts 328 may be partof stacked contact modules received in the housing 322.

The electrical connector 320 is configured to be mated with a matingelectrical connector 330. In the illustrated embodiment, the electricalconnector 320 is a receptacle connector and the mating electricalconnector 330 is a plug connector. The mating electrical connector 330may be a cable connector having a plurality of cables 332. In theillustrated embodiment, the cables 332 are terminated to a paddle card334 held in a housing 336 of the mating electrical connector 330. Thepaddle card 334 is received in a card slot 338 in the housing 322 of theelectrical connector 320 and electrically connected to the contacts 328.Other types of electrical connectors 320 and mating electricalconnectors 330 may be used in alternative embodiments.

In an exemplary embodiment, electrical paths 340 are defined between theelectronic package 104 and the electrical component 108 by the socketcontacts 142, the upper contact pads 270, the traces 290, the uppercontact pads 280 and the contacts 328. The electrical paths 340 may beused for high speed data signals however, the electrical paths 340 mayadditionally or alternatively be used for other purposes such as lowspeed data signals, power paths, and the like.

The tube contacts 424 are received in openings in the socket substrate120. In an exemplary embodiment, the tube contacts 424 are electricallyconnected to the socket substrate conductors 122 that are electricallyconnected to the host circuit board 110. The tube contacts 424 areelectrically connected to corresponding conductive vias 272 and/or uppercontact pads 270, such as at the base 404. The spring fingers 420 extendinto the receptacle 426 to engage the pin contact 412. The springfingers 420 engage the pin contacts 412 interior of the socket substrate120, such as below the upper surface 260. The tube contacts 424 areconfigured to retain the pin contacts 412 in the receptacles 426 toprovide a hold down force on the electronic package 104. The hold downforce is greater than a spring force of the spring beams 230 of thesocket contacts 142 to compress the spring beams 210.

FIG. 9 is a schematic view of the electronic system 100 in accordancewith an exemplary embodiment. FIG. 9 illustrates the socket connector102 mounted to the host circuit board 110 and the electronic package 104coupled to the socket connector 102 similar to the embodimentillustrated in FIG. 7. FIG. 9 illustrates the electrical component 108as a cable assembly 350, which is attachable to the socket substrate 120and/or host circuit board 110 through, for example, an insulatinghousing and latch assembly (not shown). The cable assembly 350 iscoupled to the socket substrate 120 and electrically connected to theelectronic package 104 by corresponding socket substrate conductors 122.

The cable assembly 350 includes a housing 352 holding a plurality ofcables 354. The housing 352 holds contacts 356 terminated tocorresponding cables 354. The contacts 356 have mating ends 358terminated to the socket substrate 120. For example, the mating ends 358of the contacts 356 are spring biased against the upper contact pads280. Other types of cable assemblies may be used in alternativeembodiments.

In an exemplary embodiment, electrical paths 360 are defined between theelectronic package 104 and the electrical component 108 by the socketcontacts 142, the upper contact pads 270, the traces 290, the uppercontact pads 280 and the contacts 356. The electrical paths 360 may beused for high speed data signals however, the electrical paths 360 mayadditionally or alternatively be used for other purposes such as lowspeed data signals, power paths, and the like.

FIG. 10 is a schematic view of the electronic system 100 in accordancewith an exemplary embodiment. FIG. 10 illustrates the socket connector102 mounted to the host circuit board 110 and the electronic package 104coupled to the socket connector 102 similar to the embodimentillustrated in FIG. 7. FIG. 10 illustrates the electrical component 108as a cable assembly 370, which is attachable to the socket substrate 120and/or host circuit board 110 through, for example, an insulatinghousing and latch assembly (not shown). The cable assembly 370 iscoupled to the socket substrate 120 and electrically connected to theelectronic package 104 by corresponding socket substrate conductors 122.

The cable assembly 370 includes cables 374 having cable conductors 376terminated to the socket substrate 120. For example, the cableconductors 376 may be soldered directly to corresponding upper contactpads 280. Other types of cable assemblies may be used in alternativeembodiments.

In an exemplary embodiment, electrical paths 380 are defined between theelectronic package 104 and the electrical component 108 by the socketcontacts 142, the upper contact pads 270, the traces 290 (of or withinthe socket substrate 120), the upper contact pads 280 and the cableconductors 376. The electrical paths 380 may be used for high speed datasignals however, the electrical paths 380 may additionally oralternatively be used for other purposes such as low speed data signals,power paths, and the like.

It is to be understood that the above description is intended to beillustrative, and not restrictive. For example, the above-describedembodiments (and/or aspects thereof) may be used in combination witheach other. In addition, many modifications may be made to adapt aparticular situation or material to the teachings of the inventionwithout departing from its scope. Dimensions, types of materials,orientations of the various components, and the number and positions ofthe various components described herein are intended to defineparameters of certain embodiments, and are by no means limiting and aremerely exemplary embodiments. Many other embodiments and modificationswithin the spirit and scope of the claims will be apparent to those ofskill in the art upon reviewing the above description. The scope of theinvention should, therefore, be determined with reference to theappended claims, along with the full scope of equivalents to which suchclaims are entitled. In the appended claims, the terms “including” and“in which” are used as the plain-English equivalents of the respectiveterms “comprising” and “wherein.” Moreover, in the following claims, theterms “first,” “second,” and “third,” etc. are used merely as labels,and are not intended to impose numerical requirements on their objects.Further, the limitations of the following claims are not written inmeans-plus-function format and are not intended to be interpreted basedon 35 U.S.C. § 112(f), unless and until such claim limitations expresslyuse the phrase “means for” followed by a statement of function void offurther structure.

What is claimed is:
 1. A socket connector for an electronic system comprising: a socket substrate having an upper surface and a lower surface, the lower surface being mounted to a host circuit board, the socket substrate having a first mating area for mating with an electronic package and a second mating area remote from the first mating area, the socket substrate including openings therethrough between the upper surface and the lower surface, the socket substrate including first socket substrate conductors and second socket substrate conductors, the first socket substrate conductors including plated vias in corresponding openings extending between the lower surface and the upper surface at the first mating area, the second socket substrate conductors extending between the first mating area and the second mating area; an electrical component terminated to the socket substrate at the second mating area, the electrical component being electrically connected to the second socket substrate conductors; receptacle contacts electrically coupled to the plated vias of the corresponding first socket substrate conductors to define a receptacle array interface with the electronic package, the receptacle contacts having receptacles configured to receive pin contacts defining first package contacts of the electronic package to electrically connect the electronic package to the first socket substrate conductors, wherein the plated vias of the first socket substrate conductors and the receptacle contacts are configured to electrically connect the electronic package with the host circuit board; and socket contacts electrically coupled to corresponding second socket substrate conductors to define a land grid array interface with the electronic package, the socket contacts having terminating ends and mating ends, the terminating ends being terminated to corresponding second socket substrate conductors, the mating ends having deflectable spring beams configured to be terminated to corresponding second package contacts of the electronic package to electrically connect the electronic package to the second socket substrate conductors, wherein the second socket substrate conductors and the socket contacts are configured to electrically connect the electronic package with the electrical component.
 2. The socket connector of claim 1, wherein the receptacle contacts are configured to engage the first package contacts interior of the socket substrate and the socket contacts are configured to engage the second package contacts exterior of the socket substrate and above the upper surface of the socket substrate.
 3. The socket connector of claim 1, wherein the receptacle contact comprises a film contact at the upper surface having film pads extending into the receptacle to engage the corresponding pin contact.
 4. The socket connector of claim 1, wherein the receptacle contacts are configured to retain the pin contacts in the receptacles to provide a hold down force on the electronic package, the hold down force being greater than a spring force of the spring beams of the socket contacts to compress the spring beams.
 5. The socket connector of claim 1, wherein the receptacle contacts comprise tube contacts defining the receptacles, the tube contacts having spring fingers extending into the receptacle to engage the pin contacts.
 6. The socket connector of claim 1, wherein the first socket substrate conductors each comprise an upper contact pad at the upper surface, a conductive via between the upper surface and the lower surface and a lower contact pad at the lower surface configured to be terminated to a solder ball electrically connected to the host circuit board.
 7. The socket connector of claim 1, wherein the second socket substrate conductors each comprise an upper contact pad at the upper surface and at least one circuit trace extending along at least one layer of the socket substrate between the first mating area and a second mating area remote from the first mating area.
 8. The socket connector of claim 1, wherein the receptacle contacts are stamped and formed contacts defining the receptacles.
 9. The socket connector of claim 1, wherein the receptacle contacts are film contacts having a backing layer and a conductive layer on the backing layer, the backing layer being applied to the upper surface.
 10. The socket connector of claim 9, wherein the film contacts have openings through the backing layer and the conductive layer defining film pads movable relative to each other, the film pads being configured to engage the pin contacts when passed through the openings.
 11. An electronic system comprising: a host circuit board having host contacts; an electronic package having first package contacts and second package contacts; and a socket connector for electrically connecting the electronic package with the host circuit board, the socket connector comprising a socket assembly and an electrical component, the socket assembly including a socket frame, a socket substrate coupled to the socket frame, receptacle contacts coupled to the socket substrate and socket contacts coupled to the socket substrate, the socket frame having a socket opening receiving the electronic package, the socket substrate including openings therethrough between an upper surface and a lower surface, the socket substrate having first socket substrate conductors and second socket substrate conductors, the first socket substrate conductors including plated vias in corresponding openings extending between the lower surface and the upper surface, the receptacle contacts electrically coupled to corresponding first socket substrate conductors, the receptacle contacts having receptacles electrically connected to the plated vias and receiving corresponding first package contacts, the socket contacts having terminating ends and mating ends, the terminating ends being terminated to corresponding second socket substrate conductors, the mating ends having deflectable spring beams terminated to corresponding second package contacts; wherein the first socket substrate conductors and the receptacle contacts electrically connect the electronic package to the host circuit board and wherein the second socket substrate conductors and the socket contacts electrically connect the electronic package to the electrical component.
 12. The electronic system of claim 11, wherein the receptacle contacts are configured to engage the first package contacts interior of the socket substrate and the socket contacts are configured to engage the second package contacts exterior of the socket substrate and above the upper surface of the socket substrate.
 13. The electronic system of claim 11, wherein the receptacle contacts are configured to retain the pin contacts in the receptacles to provide a hold down force on the electronic package, the hold down force being greater than a spring force of the spring beams of the socket contacts to compress the spring beams.
 14. The electronic system of claim 11, wherein the first socket substrate conductors each comprise an upper contact pad at the upper surface, a conductive via between the upper surface and the lower surface and a lower contact pad at the lower surface configured to be terminated to a solder ball electrically connected to the host circuit board.
 15. The electronic system of claim 11, wherein the second socket substrate conductors each comprise an upper contact pad at the upper surface and at least one circuit trace extending along at least one layer of the socket substrate between the first mating area and a second mating area remote from the first mating area.
 16. The electronic system of claim 11, wherein the receptacle contacts comprise tube contacts defining the receptacles, the tube contacts having spring fingers extending into the receptacle to engage the pin contacts.
 17. The electronic system of claim 11, wherein the receptacle contacts are stamped and formed contacts defining the receptacles.
 18. The electronic system of claim 11, wherein the receptacle contacts are film contacts having a backing layer and a conductive layer on the backing layer, the backing layer being applied to the upper surface, the film contacts having openings through the backing layer and the conductive layer defining film pads movable relative to each other, the film pads being configured to engage the pin contacts when passed through the openings.
 19. The electronic system of claim 11, further comprising an electrical component coupled to the socket substrate at a second mating area remote from the first mating area, the electrical component being electrically connected to the socket contacts by the second socket substrate conductors. 